SCHMID Group N.V. Class A Ordinary Shares·Industrials
SCHMID Group N.V. develops and manufactures equipment and process solutions for electronics, photovoltaics, glass, and energy systems in Germany and internationally. The company offers electronics equipment, ET board, vertical and horizontal wet process, vacuum metallization and tech, plating, chemical mechanical polishing, and automation system solutions; and systems and process solutions for manufacturing and processing photovoltaic products, such as wafers, cells, modules, and thin films, as well as turnkey production lines. It also provides maintenance, after sales, customer training, and on-site services, as well as offers spare parts. The company was founded in 1864 and is based in Freudenstadt, Germany.
Industrials
Industrial - Machinery
800
2024-05-01
-0.35

SCHMID Group N.V. Announces Various Share Issuances to Off-set Liabilities, to Directors & Officers and Key Employees and for Convertible Notes Conversions

SCHMID Group N.V. (SHMD) Q4 2025 Earnings Call Transcript

SCHMID Group NASDAQ: SHMD said it expects stronger order activity through the remainder of 2026 as demand tied to artificial intelligence infrastructure, optical modules and advanced packaging supports its equipment business.

FREUDENSTADT, Germany, May 08, 2026 (GLOBE NEWSWIRE) -- SCHMID Group N.V. (NASDAQ: SHMD) (the “Company” or “SCHMID”), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, today announced that it will host an investor conference call and webcast to discuss its annual financial results and business update.

SCHMID Group NV (NASDAQ:SHMD) shares are sliding on Monday. The stock seems to be getting caught in broader market pressure, with the Nasdaq down 0.32% and the S&P 500 off 0.46%.

FREUDENSTADT, Germany, April 30, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging. As AI, high-performance computing (HPC), advanced server architectures, and heterogeneous integration continue to drive unprecedented substrate complexity, manufacturers face increasing requirements for ultra-fine line structures, superior signal integrity, enhanced power delivery, and scalable production platforms capable of supporting high-volume manufacturing.