ChipMOS TECHNOLOGIES Inc.·Technology

HSINCHU, May 27, 2026 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), announced that at the Company's AGM on May 26, 2026 shareholders approved a cash dividend distribution from its capital surplus of NT$1.23 per common share or approximately US$0.78 per ADS.

On May 22, 2026, ChipMOS TECHNOLOGIES Inc (IMOS) shares rose 4.0% today, with the current price at $51.02. The stock has experienced a significant price perform

HSINCHU, May 20, 2026 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will present to institutional investors at Cathay Securities 2026 Q2 Industry Forum, at the Grand Hyatt Taipei on Wednesday, May 27, 2026.

HSINCHU, May 8, 2026 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of April 2026.

Shares of Chipmos Technologies (NASDAQ: IMOS - Get Free Report) saw unusually-high trading volume on Friday. Approximately 26,640 shares traded hands during trading, a decline of 44% from the previous session's volume of 47,224 shares.The stock last traded at $46.5450 and had previously closed at $49.17. Analysts Set New Price Targets Several research firms have

On April 16, 2026, ChipMOS TECHNOLOGIES Inc (IMOS) shares rose 14.5%, bringing the current price to $49.17. This price is significantly higher within the contex
ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.
Technology
Semiconductors
5,688
2003-07-03
1.17